CuMoCu

Classification :

Heat Sink

Description :

Cu/Mo/Cu laminates developed have an adjustable coefficient of thermal expansion that can be correlated with a range of semiconductor substrates while simultaneously maintaining high thermal conductivity. These aspects make them a perfect choice for high power devices where significant heat is produced.

Keywords :

mail:

janet@tungstenmoly.com

Online message

Return

CuMoCu

CuMoCu: Copper-Molybdenum-Copper Laminates

Application : Microwave carriers, and heat sinks, BGA packages,LED packages, GaAs device mounts.

Cu/Mo/Cu laminates also have moderate thermal conductivity and low thermal and electrical resistance. They are suitable for Si-based devices as well as for large area power devices with significant heat generation.

Thermal Conductivity and Thermal Expansion-Mismatch

Thermal conductivity and the coefficient of thermal expansion-mismatch of a given die are some of the key parameters involved in selecting a heat spreader material. These two parameters can be calculated by introducing a Thermal Compatibility Factor for a given heat spreader material in a simple equation: (Heat Spreader) / A CTE (Die - Heat Spreader). The ensuing ratio may be utilized to assess the compatibility of a heat spreader material with a given die. A high compatibility factor results from a low coefficient of thermal expansion-mismatch and a high thermal conductivity value.

Cu/Mo/Cu materials	Density g/cc at 20?	Coefficient of thermal expansion at 20?	Thermal conductivity at 25?
Cu/Mo/Cu materials	Density g/cc at 20?	Coefficient of thermal expansion at 20?	In-plane	thru-thickness
13:74:13	9.88	5.6	200	170
1:4:1	9.75	6.0	220	180
1:3:1	9.66	6.8	244	190
1:2:1	9.54	7.8	260	210
1:1:1	9.32	8.8	305	250