CuMoCu
Classification :
Heat Sink
Description :
Cu/Mo/Cu laminates developed have an adjustable coefficient of thermal expansion that can be correlated with a range of semiconductor substrates while simultaneously maintaining high thermal conductivity. These aspects make them a perfect choice for high power devices where significant heat is produced.
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CuMoCu
CuMoCu: Copper-Molybdenum-Copper Laminates
Cu/Mo/Cu laminates developed have an adjustable coefficient of thermal expansion that can be correlated with a range of semiconductor substrates while simultaneously maintaining high thermal conductivity. These aspects make them a perfect choice for high power devices where significant heat is produced.
Application : Microwave carriers, and heat sinks, BGA packages,LED packages, GaAs device mounts.
Cu/Mo/Cu laminates also have moderate thermal conductivity and low thermal and electrical resistance. They are suitable for Si-based devices as well as for large area power devices with significant heat generation.
Thermal Conductivity and Thermal Expansion-Mismatch
Thermal conductivity and the coefficient of thermal expansion-mismatch of a given die are some of the key parameters involved in selecting a heat spreader material. These two parameters can be calculated by introducing a Thermal Compatibility Factor for a given heat spreader material in a simple equation: (Heat Spreader) / A CTE (Die - Heat Spreader). The ensuing ratio may be utilized to assess the compatibility of a heat spreader material with a given die. A high compatibility factor results from a low coefficient of thermal expansion-mismatch and a high thermal conductivity value.
Physical Properties of Major Products
Cu/Mo/Cu materials |
Density g/cc at 20? |
Coefficient of thermal expansion at 20? |
Thermal conductivity at 25? |
|
In-plane |
thru-thickness |
|||
13:74:13 |
9.88 |
5.6 |
200 |
170 |
1:4:1 |
9.75 |
6.0 |
220 |
180 |
1:3:1 |
9.66 |
6.8 |
244 |
190 |
1:2:1 |
9.54 |
7.8 |
260 |
210 |
1:1:1 |
9.32 |
8.8 |
305 |
250 |
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