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Molybdenum Copper plate/MoCu/CuMoCu

Molybdenum Copper plate/MoCu/CuMoCu


Molybdenum Copper plate/MoCu/CuMoCu

*  MoCu: Molybdenum-Copper Laminates

They are composites of molybdenum and copper. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the content of molybdenum. Mo-Cu is much lighter than W-Cu so that it is suitable for aeronautic and astronautic applications.

Our products are widely used in applications such as electronics packages, Microwave Packages, C Packages, Laser Submounts, etc.


o High thermal conductivity since no sintering additives have been used

o Excellent hermeticity

o Relatively small density

o Stampable sheets available (Mo content no more than 75 wt%)

o Semi-finished or finished (Ni/Au plated) parts available

Physical Properties of Major Products

Grade Molybdenum Content Copper Content Density g/cc at 20℃ Thermal conductivity at 25℃ Coefficient of thermal expansion at 20℃
Mo85Cu15 85±1 Balance 10 160-180 6.8
Mo80Cu20 80±1 Balance 9.9 170-190 7.7
Mo70Cu30 70±1 Balance 9.8 180-200 9.1
Mo60Cu40 60±1 Balance 9.66 210-250 10.3
Mo50Cu50 50±0.2 Balance 9.54 230-270 11.5


*   CuMoCu: Copper-Molybdenum-Copper Laminates

Cu/Mo/Cu laminates developed have an adjustable coefficient of thermal expansion that can be correlated with a range of semiconductor substrates while simultaneously maintaining high thermal conductivity. These aspects make them a perfect choice for high power devices where significant heat is produced.


Cu/Mo/Cu laminates also have moderate thermal conductivity and low thermal and electrical resistance. They are suitable for Si-based devices as well as for large area power devices with significant heat generation.

Thermal Conductivity and Thermal Expansion-Mismatch

Thermal conductivity and the coefficient of thermal expansion-mismatch of a given die are some of the key parameters involved in selecting a heat spreader material. These two parameters can be calculated by introducing a Thermal Compatibility Factor for a given heat spreader material in a simple equation: (Heat Spreader) / A CTE (Die - Heat Spreader). The ensuing ratio may be utilized to assess the compatibility of a heat spreader material with a given die. A high compatibility factor results from a low coefficient of thermal expansion-mismatch and a high thermal conductivity value.



Physical Properties of Major Products

Cu/Mo/Cu materials Density g/cc at 20℃ Coefficient of thermal expansion at 20℃ Thermal conductivity at 25℃
In-plane thru-thickness
13:74:13 9.88 5.6 200 170
1:4:1 9.75 6.0 220 180
1:3:1 9.66 6.8 244 190
1:2:1 9.54 7.8 260 210
1:1:1 9.32 8.8 305 250



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