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Electronic Packaging Materials/heat sink

Electronic Packaging Materials/heat sink

PRODUCT DETAILS

Electronic Packaging Materials

 heat sink/heat sink

Packaging materials strongly effect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.

 

Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates

Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.

Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc. 

More tungsten copper heat sinker we could supply:

tungsten copper heat base/Heat Sinks/Copper Tungsten Heatsink/Tungsten Copper Laser Heat Sink/W70 Tungsten Copper Heat Sink/W75 Tungsten Copper Heat Sink/W80 Tungsten Copper Heat Sink/W85 Tungsten Copper Heat Sink/Microwave Component Heat Sink/Integrated Circuit Heat Sink/Electronic Radiator Heat Sink/WCu CPU Heat Sink/Plate Heat Exchanger Heat Sink/Heat Sink Performance/Heat Sink Proportion

Advantages

o High thermal conductivity

o Excellent hermeticity

o Excellent flatness, surface finish, and size control

o Semi-finished or finished (Ni/Au plated) products available

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