Electronic Packaging Materials
heat sink/heat sink
Packaging materials strongly effect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates
Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.
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o High thermal conductivity
o Excellent hermeticity
o Excellent flatness, surface finish, and size control
o Semi-finished or finished (Ni/Au plated) products available
Add:Changhai business base of high-tech Development Zone Lugu Avenue No. 627, Changsha,Hunan, China
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